Specification:

• Thermal Pads have excellent thermal conductivity and electrical insulation, which can meet the requirements for thermal conductivity and insulation of most electronic products. Professional thermal diffusion assistant for high heating chips and electronic components.
• KEY INDICATORS: [Composition: high thermal conductive powder silicone], [Thermal Conductivity Coefficient: 6-W/mK], [Working Temperature: - 40 to 200 °C], [Density: 3.2g/cc], [Thickness: 1mm], [Shore : 55 ± 5], [Breakdown voltage: 9.8KV], [Tensile Strength: 15], [Volume Resistance: ρ_v ≥10^14 Ω/cm], [Fire Rating: 94v0], [Corrosion Resistance], [Tear Resistance], [Extendable], [Non Toxic].
• SCOPE OF APPLICATION: Perfect Cooling for CPU, GPU, PS5, PS4, PC, Heat Sink, Auto, Control Board, Motor, Electronics, Computer Host, Laptop, SSD, TV LED IC SMD DIP and any cooling modules.

• [Step 1, clean the dust on the chip or device surface.]
• [Step 2, measure the size and cut out the appropriate shape.]
• [Step 3, install it on the surface of the component.]
• [Step 4, install the the component back and done.]
• [Tips: after installation, please run at full load for 20 minutes, because the thermal pad needs to be properly baked to shape]